SPECIFICATIONS
| Essentials | ||
| Status | Launched | |
| Launch Date | Q3'11 | |
| Expected Discontinuance | Q3'2013 | |
| Processor Number | G860 | |
| # of Cores | 2 | |
| # of Threads | 2 | |
| Clock Speed | 3 GHz | |
| Intel® Smart Cache | 3 MB | |
| DMI | 5 GT/s | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE4.1/4.2 | |
Embedded Options Available | No | |
| Lithography | 32 nm | |
| Max TDP | 65 W | |
| Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1066/1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21 GB/s | |
| Graphics Specifications | ||
| Processor Graphics | Intel® HD Graphics | |
| Graphics Base Frequency | 850 MHz | |
| Graphics Max Dynamic Frequency | 1.1 GHz | |
| Intel® Quick Sync Video | No | |
| Intel® InTru™ 3D Technology | No | |
| Intel® Insider™ | No | |
| Intel® Wireless Display | No | |
| Intel® Flexible Display Interface (Intel® FDI) | Yes | |
| Intel® Clear Video HD Technology | No | |
| # of Displays Supported | 2 | |
| Expansion Options | ||
| PCI Express Revision | 2.0 | |
| Package Specifications | ||
| Max CPU Configuration | 1 | |
| TCASE | 69.1°C | |
| Package Size | 37.5mm x 37.5mm | |
| Sockets Supported | FCLGA1155 | |
| Low Halogen Options Available | See MDDS | |
| Advanced Technologies | ||
| Intel® vPro Technology | No | |
| Intel® Hyper-Threading Technology | No | |
| Intel® Virtualization Technology (VT-x) | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No | |
| Intel® Trusted Execution Technology | No | |
| AES New Instructions | No | |
| Intel® 64 | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Thermal Monitoring Technologies | Yes | |
| Intel® Fast Memory Access | Yes | |
| Intel® Flex Memory Access | Yes | |
| Execute Disable Bit | Yes | |
| Intel® VT-x with Extended Page Tables (EPT) | Yes | |
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